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ESTechnical accept no responsibility or liability for personal injury or damage to property – Perform testing on waste boards until you are confident the settings are correct for your oven, boards and parts density etc.
Place the reflow oven on a hard, level and heat resistant surface. Do not cover any holes in the oven housing – the airflow is necessary, damage to the oven and/or your PCBs will result if airflow is impeded.
Always allow the oven to cool to below 50 degrees (as reported on the display) before stopping the cycle or attempting to remove the boards from the drawer. Do not stop a reflow cycle and begin another without first allowing the oven to cool to near ambient air temperature.
Never start a reflow cycle with hot PCB(s) - allow to cool first.
Ensure adequate ventilation in the work area, air extraction is essential if working in a confined space.
Place boards to be soldered centrally in the drawer of the oven. If a small board is being soldered, it is best to position this below the thermocouple towards the front of the oven. This will provide the most accurate temperature control. Always ensure there is PCB below the oven thermocouple.
EC Declaration of Conformity
In accordance with EN ISO 17050-1:2004
12 Ormonde Road,
in accordance with the following Directive(s):
|2004/108/EEC||The Electromagnetic Compatibility Directive|
hereby declare that:
ESTechnical Reflow Oven T962A
the equipment named above complies with all applicable Essential Requirements of the Directives.
Signed by: Ed Simmons
Carried out at:
12 Ormonde Road,
16th September 2013
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